Chipbond Technology (6147.TWO) stock: key figures, P/E, revenue and dividend
Information Technology · Semiconductors · Taiwan · ISIN TW0006147002
Chipbond Technology financials
| Fiscal year | 2024 | 2025 |
|---|---|---|
| Revenue | 20.34 bn TWD | 21.45 bn TWD |
| Gross profit | 4.57 bn TWD | 4.59 bn TWD |
| Operating income | 2.54 bn TWD | 2.40 bn TWD |
| EBIT | 4.77 bn TWD | 3.28 bn TWD |
| Net income | 4.13 bn TWD | 2.78 bn TWD |
| Diluted EPS – continuing operations | 5.55 TWD | 3.73 TWD |
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About Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductors; invests in, develops, manufactures, and sells electronic components; and manufactures and sales elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.
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Not investment advice. All data without warranty, price as of 29.10.2026. Details in the risk notice.