China Wafer Level Csp Co Ltd (603005.SS) stock: key figures, P/E, revenue and dividend

Information Technology · Semiconductors · China · ISIN CNE100001SM0

Price
22.31 CNY
Market cap
14.47 bn CNY
P/E (2025)
39.14
P/S (2025)
9.82
Dividend yield
0.54 %
Net margin
25.08 %
Return on equity (ROE)
8.02 %
Return on assets (ROA)
7.15 %

China Wafer Level Csp Co Ltd financials

Fiscal year20242025
Revenue1.13 bn CNY1.47 bn CNY
Gross profit441.32 m CNY661.01 m CNY
Operating income288.28 m CNY418.47 m CNY
EBIT284.22 m CNY426.48 m CNY
Net income252.76 m CNY369.62 m CNY
Diluted EPS – continuing operations0.39 CNY0.57 CNY

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About China Wafer Level Csp Co Ltd

China Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, lead frame, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services, as well as packaging and testing services. In addition, the company offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives, as well as FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. Further, it engages in research and development; patent management; field application promotion; investment management; and technology development activities. It exports its products. The company serves mobile handset manufacturers and semiconductor chip design houses. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.

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Not investment advice. All data without warranty, price as of 05.11.2026. Details in the risk notice.