Taiwan IC Packaging (3372.TWO) stock: key figures, P/E, revenue and dividend

Information Technology · Semiconductors · Taiwan · ISIN TW0003372009

Price
13.20 TWD
Market cap
3.11 bn TWD
P/E (2025)
–
P/S (2025)
2.83
Dividend yield
0.00 %
Net margin
-19.44 %
Return on equity (ROE)
-14.23 %
Return on assets (ROA)
-11.58 %

Taiwan IC Packaging financials

Fiscal year20242025
Revenue904.16 m TWD1.10 bn TWD
Gross profit-146.61 m TWD-122.04 m TWD
Operating income-242.25 m TWD-215.14 m TWD
EBIT-184.56 m TWD-212.88 m TWD
Net income-185.38 m TWD-213.69 m TWD
Diluted EPS – continuing operations-1.02 TWD-1.17 TWD

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About Taiwan IC Packaging

Taiwan IC Packaging Corporation develops semiconductor packaging and testing services in Taiwan, South Korea, the United States, and internationally. It offers advanced and traditional lead frame type integrated circuit packaging services. The company was founded in 1998 and is based in Kaohsiung, Taiwan.

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Not investment advice. All data without warranty, price as of 13.11.2026. Details in the risk notice.